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品牌：Intel
类别：酷睿处理器
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品牌：Intel
类别：酷睿处理器
-
品牌：Intel
类别：酷睿处理器
-
品牌：Intel
类别：酷睿处理器
-
品牌：Intel
类别：酷睿处理器
| 参数 | 数值 |
|---|---|
| Processing Die Size | 164 mm 2 |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
| L2 Cache | 6 MB |
| Launch Date | Q3'08 |
| Lithography | 45 nm |
| Low Halogen Options Available | See MDDS |
| Max TDP | 95 W |
| Package Size | 37.5mm x 37.5mm |
| Intel® Turbo Boost Technology | No |
| Processor Number | Q9400 |
| Recommended Customer Price | TRAY: $183 BOX : $200 |
| Sockets Supported | LGA775 |
| Status | Launched |
| Supplemental SKU | No |
| T CASE | 71.4°C |
| Thermal Monitoring Technologies | Yes |
| VID Voltage Range | 0.8500v-1.3625v |
| FSB Parity | No |
| # of Processing Die Transistors | 456 million |
| # of Threads | 4 |
| AES New Instructions | No |
| Bus/Core Ratio | 8 |
| Clock Speed | 2.66 GHz |
| Embedded Options Available | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Execute Disable Bit | Yes |
| # of Cores | 4 |
| FSB Speed | 1333 MHz |
| Idle States | Yes |
| Instruction Set | 64-bit |
| Intel® 64 | Yes |
| Intel® Demand Based Switching | No |
| Intel® Hyper-Threading Technology | No |
| Intel® Trusted Execution Technology | Yes |
这些多核处理器基于英特尔® 酷睿™ 微架构和 45 纳米技术，并具备增大的高速缓存容量；它们提高了多线程应用和多任务环境的计算能力，以满足要求高性能、低能耗的嵌入式应用的需求。
- 英特尔® 虚拟化技术： 在单一硬件平台上实现多个环境以提高灵活性和系统利用率。
- 英特尔® 可信执行技术： 实现测量启动和保护执行等安全性功能。
- 英特尔® 高级智能高速缓存： 通过动态分配共享的二级高速缓存而提高系统性能。
- 英特尔® 64 架构： 支持 64 位指令。
交互式结构图
应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 2 | White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms | White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms |
| 3 | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms |
| 4 | White Paper: Designing Systems without a Suspend Supply | White Paper: Designing Systems without a Suspend Supply |
| 5 | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles |
| 6 | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
| 7 | White Paper: Interfacing I²C Devices to Intel's SMBus Controller | White Paper: Interfacing I²C Devices to Intel's SMBus Controller |
| 8 | White Paper: JTAG 101 | White Paper: JTAG 101 |
| 9 | White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons | White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations |
| 10 | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs |
| 11 | White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture | White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture Systems |
| 12 | White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts | White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts |
| 13 | White Paper: Seven Tips to Get Started on Embedded Multi-Core | White Paper: Seven Tips to Get Started on Embedded Multi-Core |
| 14 | White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines | White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines |
| 15 | White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane | White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane |
| 16 | Application Note: Designing Embedded Systems for Testability | Application Note: Designing Embedded Systems for Testability |
| 17 | Application Note: AP-485 Intel® Processor Identification and CPUID Instruction | Application Note: AP-485 Intel® Processor Identification and CPUID Instruction |
| 18 | Solution Brief: Intel® Delivers Energy Efficient Multi-Core Performance for Advantech*’s Latest HMI/ | Solution Brief: Intel® Delivers Energy Efficient Multi-Core Performance for Advantech*’s Latest HMI/SCADA Industrial Panel PC |
| 19 | White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets | White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets |
| 20 | White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model | White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model |
| 21 | White Paper: Choosing the Right Storage Solution for Your Embedded Application | White Paper: Choosing the Right Storage Solution for Your Embedded Application |
性能指标评测
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms | White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms |
| 2 | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
| 3 | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization |
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Thermal Design Considerations for Embedded Applications | White Paper: Thermal Design Considerations for Embedded Applications |
| 2 | Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and | Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series |
| 3 | Intel® G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Thermal Design Guide | Intel® G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Thermal Design Guide |
| 4 | Power Profiling for Embedded Applications | Power Profiling for Embedded Applications |
| 5 | Thermal & Mechanical Design Guidelines: Intel® 4 Series Chipset Family | Thermal & Mechanical Design Guidelines: Intel® 4 Series Chipset Family |
| 6 | Thermal & Mechanical Design Guidelines: Intel® I/O Controller Hub 10 (ICH10) Family | Thermal & Mechanical Design Guidelines: Intel® I/O Controller Hub 10 (ICH10) Family |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 产品简介： 适用于嵌入式计算的英特尔® Q45 高速芯片组 | 产品简介： 适用于嵌入式计算的英特尔® Q45 高速芯片组 |
| 2 | 产品简介： 英特尔® 奔腾® 处理器 E6500、E5300 和 E2160 | 产品简介： 英特尔® 奔腾® 处理器 E6500、E5300 和 E2160 |
| 3 | 支持嵌入式计算的 英特尔® 酷睿™2 四核处理器 Q9400 | 支持嵌入式计算的 英特尔® 酷睿™2 四核处理器 Q9400 |
| 4 | 支持嵌入式计算的英特尔®酷睿™2 双核处理器 E8400、E7400、E6400 和 E4300 | 支持嵌入式计算的英特尔®酷睿™2 双核处理器 E8400、E7400、E6400 和 E4300 |
| 5 | Product Brief: Intel® 82576 Gigabit Ethernet Controller | Product Brief: Intel® 82576 Gigabit Ethernet Controller |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | 产品简介： 适用于嵌入式计算的英特尔® Q45 高速芯片组 | 产品简介： 适用于嵌入式计算的英特尔® Q45 高速芯片组 |
| 2 | Datasheet: Intel® 4 Series Express Chipset Family | Datasheet: Intel® 4 Series Express Chipset Family |
| 3 | Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller | Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller |
| 4 | Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and | Datasheet: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series |
| 5 | Datasheet: Intel® I/O Controller Hub 10 (ICH10) Family | Datasheet: Intel® I/O Controller Hub 10 (ICH10) Family |
| 6 | Specification Update: Intel® 82576 Gigabit Ethernet Controller | Specification Update: Intel® 82576 Gigabit Ethernet Controller |
| 7 | Specification Update: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor | Specification Update: Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series -NDA |
| 8 | Specification Update: Intel® I/O Controller Hub 10 (ICH10) Family | Specification Update: Intel® I/O Controller Hub 10 (ICH10) Family |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Product Brief: Intel® 82576 Gigabit Ethernet Controller | Product Brief: Intel® 82576 Gigabit Ethernet Controller |
| 2 | Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller | Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller |
| 3 | Specification Update: Intel® 82576 Gigabit Ethernet Controller | Specification Update: Intel® 82576 Gigabit Ethernet Controller |
开发主板和套件
| 序号 | 描述 | |
|---|---|---|
| 1 | Intel® Core™2 Duo Processor and Intel® Q45 Express Chipset Development Kit User Manual | Intel® Core™2 Duo Processor and Intel® Q45 Express Chipset Development Kit User Manual |
