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品牌：Intel
类别：酷睿处理器
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品牌：Intel
类别：酷睿处理器
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品牌：Intel
类别：酷睿处理器
-
品牌：Intel
类别：酷睿处理器
-
品牌：Intel
类别：酷睿处理器
| 参数 | 数值 |
|---|---|
| Max Memory Bandwidth | 21.3 GB/s |
| Intel® My WiFi Technology | No |
| Intel® Quick Sync Video | No |
| Intel® Smart Cache | 2 MB |
| Intel® Trusted Execution Technology | No |
| Intel® Turbo Boost Technology | No |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) | No |
| Intel® vPro Technology | No |
| Intel® Wireless Display | No |
| Launch Date | Q2'11 |
| Lithography | 32 nm |
| Low Halogen Options Available | See MDDS |
| Macrovision* License Required | No |
| Intel® InTru™ 3D Technology | No |
| Max Memory Size (dependent on memory type) | 16 GB |
| Max TDP | 17 W |
| Memory Types | DDR3-1066/1333 |
| Package Size | 31mm x 24mm (FCBGA1023) |
| PCI Express Configurations | 1x16, 2x8, 1x8 2x4 |
| PCI Express Revision | 2.0 |
| Processor Graphics | Intel® HD Graphics |
| Processor Number | 847E |
| Recommended Customer Price | TRAY: $134 |
| Sockets Supported | FCBGA1023 |
| Status | Launched |
| T JUNCTION | 100 |
| Thermal Monitoring Technologies | Yes |
| Graphics and IMC Lithography | 32nm |
| # of Displays Supported | 2 |
| # of Memory Channels | 2 |
| # of PCI Express Ports | 16 |
| # of Threads | 2 |
| 4G WiMAX Wireless Technology | No |
| AES New Instructions | No |
| Bus/Core Ratio | 11 |
| Clock Speed | 1.1 GHz |
| Datasheet Url | Link |
| Dual Display Capable | Yes |
| ECC Memory Supported | Yes |
| Embedded Options Available | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| # of Cores | 2 |
| Graphics Base Frequency | 350 MHz |
| Graphics Max Dynamic Frequency | 800 MHz |
| Graphics Output | eDP/DP/HDMI/SDVO/CRT |
| Idle States | Yes |
| Instruction Set | 64-bit |
| Intel® 64 | Yes |
| Intel® Anti-Theft Technology | No |
| Intel® Clear Video HD Technology | No |
| Intel® Demand Based Switching | No |
| Intel® Fast Memory Access | Yes |
| Intel® Flex Memory Access | Yes |
| Intel® Hyper-Threading Technology | No |
这些低功耗处理器基于采用 32 纳米技术的英特尔® 微体系（代号：Sandy Bridge）。此平台提供了高性能、远程可管理性和安全性、ECC 和节能功能，是各种不同的嵌入式应用程序的理想选择。
- 英特尔® 高级矢量扩展： 加速浮点计算的性能。
- 英特尔® 核芯显卡 3000 和英特尔® 快速同步视频： 支持高端增强视频和图形功能，并提高性能。
- 英特尔® 睿频加速技术 2.0： 利用可用的温度余地以更高的频率更快地运行应用程序。
- 英特尔® 博锐™ 技术： 为关键的安全性和远程管理功能提供前所未有的硬件支持。
交互式结构图
开发主板和套件
| 序号 | 描述 | |
|---|---|---|
| 1 | User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Ki | User Guide: 2nd Generation Intel® Core™ Processor Family with Intel® 6 Series Chipset Development Kit |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 平台简介：采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。 | 平台简介：采用英特尔® QM67 高速芯片组和英特尔® HM65 高速芯片组的第二代英特尔® 酷睿™ i7、酷睿™ i5 和酷睿™ i3 处理器。 |
| 2 | 平台简介： 英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组 | 平台简介： 英特尔® 赛扬® 处理器 B810 与移动式英特尔® QM67 高速芯片组和移动式英特尔® HM65 高速芯片组 |
| 3 | 产品简介： 第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件 | 产品简介： 第二代智能英特尔® 酷睿™ i7 处理器系列与英特尔® QM67 高速芯片组开发套件 |
| 4 | 产品简介： 第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件 | 产品简介： 第二代英特尔® 酷睿™ i7-2710QE 处理器与英特尔® QM67 高速芯片组开发套件 |
应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performa | White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performance on Linux* |
| 2 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 3 | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors |
| 4 | White Paper: Intel® Virtualization Technology for Directed I/O | White Paper: Intel® Virtualization Technology for Directed I/O |
| 5 | White Paper: High Performance Storage Encryption on Intel® Architecture Processors | White Paper: High Performance Storage Encryption on Intel® Architecture Processors |
| 6 | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors |
| 7 | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors |
| 8 | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms |
| 9 | White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family | White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family |
| 10 | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs |
| 11 | Solution Brief: Going Beyond Exceptional Computing Performance | Solution Brief: Going Beyond Exceptional Computing Performance |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection | Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection |
| 2 | Schematic: Intel® 82579 Gigabit Ethernet PHY | Schematic: Intel® 82579 Gigabit Ethernet PHY |
| 3 | Datasheet: Intel® 82579 Gigabit Ethernet PHY | Datasheet: Intel® 82579 Gigabit Ethernet PHY |
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser | Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset |
| 2 | Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family | Thermal Design Guide: 2nd Generation Intel® Core™ Processor (Mobile) Family |
| 3 | Application Power Guideline Addendum: Intel® Celeron® Processor 827E | Application Power Guideline Addendum: Intel® Celeron® Processor 827E |
| 4 | Application Power Guideline Addendum: Intel® Celeron® Processor 807UE | Application Power Guideline Addendum: Intel® Celeron® Processor 807UE |
| 5 | Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor | Application Power Guideline Addendum: 2nd Generation Intel® Core™ i7-2715QE Processor |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Specification Update: Intel® 6 Series and Intel® C200 Series Chipset | Specification Update: Intel® 6 Series and Intel® C200 Series Chipset |
| 2 | Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family | Specification Update: 2nd Generation Intel® Core™ Processor (Mobile) Family |
| 3 | Datasheet: Intel® 6 Series and Intel® C200 Series Chipset | Datasheet: Intel® 6 Series and Intel® C200 Series Chipset |
| 4 | Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2 | Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 2 of 2 |
| 5 | Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2 | Datasheet: 2nd Generation Intel® Core™ Processor (Mobile) Family—Volume 1 of 2 |
| 6 | Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC | Datasheet Addendum: 2nd Generation Intel® Core™ Processor Family Mobile with ECC |
