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品牌：Intel
类别：芯片组
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品牌：Intel
类别：芯片组
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品牌：Intel
类别：芯片组
-
品牌：Intel
类别：芯片组
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品牌：Intel
类别：芯片组
| 参数 | 数值 |
|---|---|
| Product name | Intel® BD3420 PCH |
| Code Name | Formerly Ibex Peak |
| Datasheet | Download Datasheet |
| Dual Independent Display | No |
| Graphics Output | None |
| Integrated Graphics | No |
| Launch Date | Q3'09 |
| Low Halogen Available | See MDDS |
| Package Size | 27mm x 27mm |
PCI Express* 通道集成入处理器消除了对独立 I/O 中枢芯片的需要，因而减少芯片总数，并降低总体系统功耗。此处理器提供比前代处理器更佳的性能功耗比，并结合了 PCIe* 非透明桥接、RAID 和 DRAM 自刷新等功能。
- 多种处理器： 23W 单核到 85W 四核，支持单或双处理器配置。
- 英特尔® 快速通道互联技术： 为数据密集型应用提供改进的带宽。
- 英特尔® 虚拟化技术： 处理器对硬件协助虚拟化的支持以及芯片组针对直接 I/O（VT-d）的英特尔® 虚拟化技术。
- 英特尔® 超线程技术： 提高应对并行、多线程应用的性能
交互式结构图
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series | Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series |
| 2 | Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Ser | Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Series Chipset |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 基于英特尔® 至强® 处理器 C5500/C3500 系列的平台 | 基于英特尔® 至强® 处理器 C5500/C3500 系列的平台 |
应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Preparing for the New Wave of On-Demand TV Services | White Paper: Preparing for the New Wave of On-Demand TV Services |
| 2 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 3 | White Paper: Non-transparent Bridge on the Intel® Xeon® Processor C5500/C3500 Series | White Paper: Non-transparent Bridge on the Intel® Xeon® Processor C5500/C3500 Series |
| 4 | White Paper: JTAG 101 | White Paper: JTAG 101 |
| 5 | White Paper: First the Tick, Now the Tock: Next Generation Intel® Microarchitecture (Nehalem) | White Paper: First the Tick, Now the Tock: Next Generation Intel® Microarchitecture (Nehalem) |
| 6 | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles |
| 7 | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors |
| 8 | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms |
| 9 | White Paper: Consolidating Communications and Networking Workloads onto One Architecture | White Paper: Consolidating Communications and Networking Workloads onto One Architecture |
| 10 | White Paper: Choosing the Right Storage Solution for Your Embedded Application | White Paper: Choosing the Right Storage Solution for Your Embedded Application |
| 11 | Solution Brief: The Right Computing Platform for Real-World Testing | Solution Brief: The Right Computing Platform for Real-World Testing |
| 12 | Case Study: Putting VoIP Calls to the Test | Case Study: Putting VoIP Calls to the Test |
| 13 | Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers | Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers |
性能指标评测
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization |
| 2 | Benchmark summary for Trenton System* Host Boards using Two, Quad-core Intel® Xeon® C5549 and Two, Q | Benchmark summary for Trenton System* Host Boards using Two, Quad-core Intel® Xeon® C5549 and Two, Quad-core Intel® Xeon® E5440 Processors |
设计计算器和清单
| 序号 | 描述 | |
|---|---|---|
| 1 | Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Ser | Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Series Chipset |
| 2 | Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series | Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series |
| 3 | Application Power Guideline Addendum: Intel® Xeon® Processor EC5549 | Application Power Guideline Addendum: Intel® Xeon® Processor EC5549 |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Specification Update: Intel® Xeon® Processor C5500/C3550 Series | Specification Update: Intel® Xeon® Processor C5500/C3550 Series |
| 2 | Specification Update: Intel® 82578 Gigabit Ethernet PHY | Specification Update: Intel® 82578 Gigabit Ethernet PHY |
| 3 | Datasheet: Intel® Xeon® Processor C5500/C3500 Series Datasheet - Volume 2 of 2 | Datasheet: Intel® Xeon® Processor C5500/C3500 Series Datasheet - Volume 2 of 2 |
| 4 | Datasheet: Intel® Xeon® Processor C5500/C3500 Series - Volume 1 of 2 | Datasheet: Intel® Xeon® Processor C5500/C3500 Series - Volume 1 of 2 |
| 5 | Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY | Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY |
| 6 | Datasheet: Intel® 5 Series Chipset and Intel® 3400 Series Chipset | Datasheet: Intel® 5 Series Chipset and Intel® 3400 Series Chipset |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Specification Update: Intel® 82578 Gigabit Ethernet PHY | Specification Update: Intel® 82578 Gigabit Ethernet PHY |
| 2 | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY |
| 3 | Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY | Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY |
示意图和规划文件
| 序号 | 描述 | |
|---|---|---|
| 1 | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY |
