| 参数 | 数值 |
|---|---|
| Intel® Quick Resume Technology | No |
| USB Revision | USB 2.0 |
| Supplemental SKU | No |
| Status | Launched |
| Recommended Customer Price | T&R : $48 |
| PCI Support | Yes |
| Package Size | 25mm x 27 mm |
| Max TDP | 3.5 W |
| Max CPU Configuration | 1 |
| Macrovision* License Required | No |
| Low Halogen Options Available | See MDDS |
| Lithography | 65 nm |
| Launch Date | Q1'10 |
| Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Trusted Execution Technology | Yes |
| Intel® Quiet System Technology | No |
| # of PCI Express Ports | 8 |
| Intel® Matrix Storage Technology | Yes |
| Intel® HD Audio Technology | Yes |
| Intel® Anti-Theft Technology | Yes |
| Intel® AMT Version | 6.0 |
| Intel® Active Management Technology | Yes |
| Intel® AC97 Technology | No |
| Integrated LAN | 10/100/1000 |
| Integrated IDE | No |
| Integrated Graphics | Yes |
| Graphics Output | LVDS, CRT, Display Port, DVI, HDMI, SVDO |
| Embedded Options Available | Yes |
| Dual Display Capable | Yes |
| # of USB Ports | 14 |
| # of SATA Ports | 6 |
体验业界标准 x86 架构的智能性能、能效、集成显卡和纠错码(ECC)内存。此双芯片平台采用英特尔® AES 新指令,以帮助加快数据加密和解密速度。
- 英特尔® 智能节能技术: 通过功率门限和自动低功耗状态降低空闲功耗。
- 英特尔® 睿频加速技术: 提高处理器频率以增强性能。
- 英特尔® 超线程技术: 并行多线程提高串行应用的性能。
- 英特尔® 博锐™ 技术: 远程管理、灵活的虚拟化以及增强的安全性功能。
交互式结构图

应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs |
| 2 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 3 | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors |
| 4 | White Paper: High Performance Storage Encryption on Intel® Architecture Processors | White Paper: High Performance Storage Encryption on Intel® Architecture Processors |
| 5 | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors |
| 6 | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors |
| 7 | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms |
| 8 | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology |
开发主板和套件
| 序号 | 描述 | |
|---|---|---|
| 1 | 英特尔®酷睿™处理器系列和移动式 特尔®QM57高速芯片组开发套件 | 英特尔®酷睿™处理器系列和移动式 特尔®QM57高速芯片组开发套件 |
| 2 | 英特尔® 酷睿™ i5 处理器和移动式英特尔® QM57 高速芯片组开发套件 | 英特尔® 酷睿™ i5 处理器和移动式英特尔® QM57 高速芯片组开发套件 |
| 3 | User Guide: Intel® Core™ i7 Processor with Intel® QM57 Express Chipset Development Kit | User Guide: Intel® Core™ i7 Processor with Intel® QM57 Express Chipset Development Kit |
| 4 | User Guide: Intel® Core™ i5 Processor with Intel® QM57 Express Chipset Development Kit | User Guide: Intel® Core™ i5 Processor with Intel® QM57 Express Chipset Development Kit |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 英特尔®酷睿™处理器系列和移动式 特尔®QM57高速芯片组开发套件 | 英特尔®酷睿™处理器系列和移动式 特尔®QM57高速芯片组开发套件 |
| 2 | 英特尔® 酷睿™ i5 处理器和移动式英特尔® QM57 高速芯片组开发套件 | 英特尔® 酷睿™ i5 处理器和移动式英特尔® QM57 高速芯片组开发套件 |
| 3 | 产品简介: 面向嵌入式计算的基于英特尔® 酷睿™ i7、英特尔® 酷睿™ i5 和英特尔® 酷睿™ i3 处理器的平台 | 产品简介: 面向嵌入式计算的基于英特尔® 酷睿™ i7、英特尔® 酷睿™ i5 和英特尔® 酷睿™ i3 处理器的平台 |
| 4 | 产品简介: 采用移动式英特尔® QM57 和移动式英特尔® HM55 高速芯片组的英特尔® 赛扬® 处理器 U3405、P4500 和 P4505 | 产品简介: 采用移动式英特尔® QM57 和移动式英特尔® HM55 高速芯片组的英特尔® 赛扬® 处理器 U3405、P4500 和 P4505 |
设计计算器和清单
| 序号 | 描述 | |
|---|---|---|
| 1 | Application Power Guideline Addendum: Intel® Core™ i5 Processor 520E | Application Power Guideline Addendum: Intel® Core™ i5 Processor 520E |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Specification Update: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series | Specification Update: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series |
| 2 | Specification Update: Intel® 82577LM/LC Gigabit Ethernet PHY | Specification Update: Intel® 82577LM/LC Gigabit Ethernet PHY |
| 3 | Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 2 | Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 2 |
| 4 | Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 1 | Datasheet: Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series—Volume 1 |
| 5 | Datasheet Addendum: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Series | Datasheet Addendum: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Series |
| 6 | Datasheet Addendum Specification Update: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Ser | Datasheet Addendum Specification Update: Intel® Core™ i7-620LE/UE, i7-610E and i5-520E Processor Series |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY |
示意图和规划文件
| 序号 | 描述 | |
|---|---|---|
| 1 | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY | Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY |
性能指标评测
| 序号 | 描述 | |
|---|---|---|
| 1 | Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture | Presentation: Image Signal Processing Performance on 2nd Generation Core™ Microarchitecture |
