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品牌：Intel
类别：凌动处理器
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品牌：Intel
类别：凌动处理器
-
品牌：Intel
类别：凌动处理器
-
品牌：Intel
类别：凌动处理器
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品牌：Intel
类别：凌动处理器
| 参数 | 数值 |
|---|---|
| Processing Die Size | 26 mm 2 |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) | No |
| L2 Cache | 512 KB |
| Launch Date | Q2'08 |
| Lithography | 45 nm |
| Low Halogen Options Available | See MDDS |
| Max TDP | 2.2 W |
| Package Size | 22mm x 22mm |
| Intel® Turbo Boost Technology | No |
| Processor Number | Z520PT |
| Recommended Customer Price | TRAY: $50 |
| Sockets Supported | FCBGA437 |
| Status | Launched |
| Supplemental SKU | No |
| T JUNCTION | 90°C |
| Thermal Monitoring Technologies | Yes |
| VID Voltage Range | 0.9V-1.1V |
| FSB Speed | 533 MHz |
| # of Processing Die Transistors | 47 million |
| # of Threads | 2 |
| Bus/Core Ratio | 10 |
| Clock Speed | 1.33 GHz |
| Embedded Options Available | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Execute Disable Bit | Yes |
| FSB Parity | No |
| # of Cores | 1 |
| Idle States | Yes |
| Instruction Set | 32-bit |
| Instruction Set Extensions | SSE2, SSE3, SSSE3 |
| Intel® 64 | No |
| Intel® Demand Based Switching | No |
| Intel® Hyper-Threading Technology | Yes |
| Intel® Trusted Execution Technology | No |
这些单核处理器有两种封装大小可选用，均具备出色的能源管理技术以增强散热限制和无风扇嵌入式应用的功能。此双芯片平台对车载信息娱乐系统、工业控制、媒体电话和交易解决方案等是理想的选择。
- 英特尔® 超线程技术： 顺序管线计算方式提供很高的性能/功耗效率。
- 能耗优化： 支持 C6 — 深度节能状态、分裂 VTT 导轨、增强的英特尔 SpeedStep® 技术和动态二级高速缓存调整
- 英特尔® 单指令多数据流扩展 3： 在复杂计算和视频解码中加快数据处理速度
- 外形： 双芯片平台有大小两种外形可用
交互式结构图
应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: JTAG 101 | White Paper: JTAG 101 |
| 2 | White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms | White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms |
| 3 | White Paper: Designing Systems without a Suspend Supply | White Paper: Designing Systems without a Suspend Supply |
| 4 | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles |
| 5 | White Paper: Fanless Cooling for Embedded Applications | White Paper: Fanless Cooling for Embedded Applications |
| 6 | White Paper: Fastboot BIOS | White Paper: Fastboot BIOS |
| 7 | White Paper: How to Design a Solar-Powered Computing Device (large and small form factors) | White Paper: How to Design a Solar-Powered Computing Device (large and small form factors) |
| 8 | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
| 9 | White Paper: Interfacing I²C Devices to Intel's SMBus Controller | White Paper: Interfacing I²C Devices to Intel's SMBus Controller |
| 10 | White Paper: Choosing the Right Storage Solution for Your Embedded Application | White Paper: Choosing the Right Storage Solution for Your Embedded Application |
| 11 | White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons | White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations |
| 12 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 13 | White Paper: Power Delivery for Embedded Intel® Atom™ Platforms | White Paper: Power Delivery for Embedded Intel® Atom™ Platforms |
| 14 | White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts | White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts |
| 15 | White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines | White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines |
| 16 | White Paper: Smart Service Companion - Intel® Atom™ Z5xx Platform-based Self-Service Device | White Paper: Smart Service Companion - Intel® Atom™ Z5xx Platform-based Self-Service Device |
| 17 | Application Note: Embedded Customization to Support VBIOS Startup Screen on Portrait Panels for XP* | Application Note: Embedded Customization to Support VBIOS Startup Screen on Portrait Panels for XP* |
| 18 | Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boo | Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boosts Performance Up to 10X |
| 19 | Intel® Technology Journal: Performance Analysis of the Intel® System Controller Hub (Intel® SCH) US1 | Intel® Technology Journal: Performance Analysis of the Intel® System Controller Hub (Intel® SCH) US15W |
| 20 | Application Note: Designing Embedded Systems for Testability | Application Note: Designing Embedded Systems for Testability |
| 21 | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology |
| 22 | White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets | White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets |
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Fanless Cooling for Embedded Applications | White Paper: Fanless Cooling for Embedded Applications |
| 2 | White Paper: Thermal Design Considerations for Embedded Applications | White Paper: Thermal Design Considerations for Embedded Applications |
| 3 | Power Profiling for Embedded Applications | Power Profiling for Embedded Applications |
性能指标评测
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms | White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms |
| 2 | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
| 3 | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 面向嵌入式计算的英特尔® 凌动™ 处理器 Z5xx 系列（大型和小型机箱） | 面向嵌入式计算的英特尔® 凌动™ 处理器 Z5xx 系列（大型和小型机箱） |
| 2 | 支持嵌入式计算的英特尔® 凌动™ 处理器 Z5xx 系列 | 支持嵌入式计算的英特尔® 凌动™ 处理器 Z5xx 系列 |
| 3 | 支持嵌入式计算的英特尔® 系统控制集线器 US15W | 支持嵌入式计算的英特尔® 系统控制集线器 US15W |
| 4 | Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers | Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers |
| 5 | Product Brief: Intel® 82583V Gigabit Ethernet Controller | Product Brief: Intel® 82583V Gigabit Ethernet Controller |
设计计算器和清单
| 序号 | 描述 | |
|---|---|---|
| 1 | Application Power Guideline Addendum: Intel® Atom™ Processor Z530 | Application Power Guideline Addendum: Intel® Atom™ Processor Z530 |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Datasheet: Intel® 82574 GbE Controller Family | Datasheet: Intel® 82574 GbE Controller Family |
| 2 | Datasheet: Intel® 82583V Gigabit Ethernet Controller | Datasheet: Intel® 82583V Gigabit Ethernet Controller |
| 3 | Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers | Product Brief: Intel® 82574L and 82574IT Gigabit Ethernet Controllers |
| 4 | Product Brief: Intel® 82583V Gigabit Ethernet Controller | Product Brief: Intel® 82583V Gigabit Ethernet Controller |
| 5 | Specification Update: Intel® 82574 GbE Controller Family | Specification Update: Intel® 82574 GbE Controller Family |
| 6 | Specification Update: Intel® 82583V Gigabit Ethernet Controller | Specification Update: Intel® 82583V Gigabit Ethernet Controller |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Datasheet: Intel® Atom™ Processor Z5xx Series (large form factor) | Datasheet: Intel® Atom™ Processor Z5xx Series (large form factor) |
| 2 | Datasheet: Intel® Atom™ Processor Z5xx Series (small form factor) | Datasheet: Intel® Atom™ Processor Z5xx Series (small form factor) |
| 3 | Datasheet: Intel® System Controller Hub (Intel® SCH) | Datasheet: Intel® System Controller Hub (Intel® SCH) |
| 4 | Datasheet: Intel® System Controller Hub (Intel® SCH) (large form factor) | Datasheet: Intel® System Controller Hub (Intel® SCH) (large form factor) |
| 5 | Specification Update: Intel® Atom™ Processor Z5xx Series (large and small form factors) | Specification Update: Intel® Atom™ Processor Z5xx Series (large and small form factors) |
| 6 | Specification Update: Intel® System Controller Hub (Intel® SCH) (large and small form factors) | Specification Update: Intel® System Controller Hub (Intel® SCH) (large and small form factors) |
开发主板和套件
| 序号 | 描述 | |
|---|---|---|
| 1 | User Manual: Intel® Atom™ Processor and Intel® System Controller Hub US15W Development Kit | User Manual: Intel® Atom™ Processor and Intel® System Controller Hub US15W Development Kit |
