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品牌：Intel
类别：至强处理器
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品牌：Intel
类别：至强处理器
-
品牌：Intel
类别：至强处理器
-
品牌：Intel
类别：至强处理器
-
品牌：Intel
类别：至强处理器
| 参数 | 数值 |
|---|---|
| Max Memory Size (dependent on memory type) | 32 GB |
| Intel® Smart Cache | 8 MB |
| Intel® Trusted Execution Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® vPro Technology | Yes |
| Intel® VT-x with Extended Page Tables (EPT) | Yes |
| Intel® Wireless Display | No |
| Launch Date | Q2'11 |
| Lithography | 32 nm |
| Low Halogen Options Available | See MDDS |
| Max CPU Configuration | 1 |
| Max Memory Bandwidth | 21 GB/s |
| Intel® Quick Sync Video | Yes |
| Max TDP | 95 W |
| Max Turbo Frequency | 3.8 GHz |
| Memory Types | DDR3-1066/1333 |
| Package Size | 37.5mm x 37.5mm |
| PCI Express Revision | 2.0 |
| Processor Graphics | Intel® HD Graphics P3000 |
| Processor Number | E3-1275 |
| Recommended Customer Price | TRAY: $339 BOX : $350 |
| Sockets Supported | LGA1155 |
| Status | Launched |
| T CASE | 72.6°C |
| Thermal Monitoring Technologies | Yes |
| Graphics Base Frequency | 850 MHz |
| # of Displays Supported | 2 |
| # of Memory Channels | 2 |
| # of PCI Express Ports | 2 |
| # of Threads | 8 |
| AES New Instructions | Yes |
| Bus/Core Ratio | 34 |
| Clock Speed | 3.4 GHz |
| Datasheet Url | Link |
| DMI | 5 GT/s |
| Dual Display Capable | Yes |
| ECC Memory Supported | Yes |
| Embedded Options Available | Yes |
| Execute Disable Bit | Yes |
| # of Cores | 4 |
| Graphics Max Dynamic Frequency | 1.35 GHz |
| Idle States | Yes |
| Instruction Set | 64-bit |
| Instruction Set Extensions | SSE4.1/4.2, AVX |
| Intel® 64 | Yes |
| Intel® Clear Video HD Technology | Yes |
| Intel® Demand Based Switching | Yes |
| Intel® Fast Memory Access | Yes |
| Intel® Flex Memory Access | Yes |
| Intel® Flexible Display Interface (Intel® FDI) | Yes |
| Intel® Hyper-Threading Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
这些四核处理器支持英特尔® 核芯显卡 P3000/2000、英特尔® 高级矢量扩展和英特尔® AES – 用于增强媒体、提高性能和改善安全性的新指令。它们提供灵活的 20 通道 PCI Express* 功能和 DDR3 内存支持。观看视频。
- 内存纠错： 在无需重置系统的情况下校正内存错误 (ECC)
- 英特尔® 睿频加速技术 2.0： 利用可用的温度余地以更高的频率更快地运行应用程序
- 英特尔® 博锐™ 技术： 为关键的安全性和远程管理功能提供前所未有的硬件支持
- 英特尔® 智能节能技术： 通过改进架构减少待机耗电量
交互式结构图
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Specification Update: Intel® Xeon® Processor E3-1200 Family | Specification Update: Intel® Xeon® Processor E3-1200 Family |
| 2 | Specification Update: Intel® 6 Series and Intel® C200 Series Chipset | Specification Update: Intel® 6 Series and Intel® C200 Series Chipset |
| 3 | Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 2 of 2 | Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 2 of 2 |
| 4 | Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 1 of 2 | Datasheet: Intel® Xeon® Processor E3-1200 Family Volume 1 of 2 |
| 5 | Datasheet: Intel® 6 Series and Intel® C200 Series Chipset | Datasheet: Intel® 6 Series and Intel® C200 Series Chipset |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 产品简介： 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组 | 产品简介： 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组 |
| 2 | 产品简介： 英特尔® 至强® 处理器 E3-1200 系列与英特尔® C206 芯片组 | 产品简介： 英特尔® 至强® 处理器 E3-1200 系列与英特尔® C206 芯片组 |
| 3 | " 产品简介： 英特尔® 奔腾® 处理器 G850 与英特尔® C206，英特尔® Q67 Express，英特尔® B65 Express 和英特尔® H61 高速芯片组 " | " 产品简介： 英特尔® 奔腾® 处理器 G850 与英特尔® C206，英特尔® Q67 Express，英特尔® B65 Express 和英特尔® H61 高速芯片组 " |
应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 2 | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors |
| 3 | White Paper: Intel® Virtualization Technology for Directed I/O | White Paper: Intel® Virtualization Technology for Directed I/O |
| 4 | White Paper: High Performance Storage Encryption on Intel® Architecture Processors | White Paper: High Performance Storage Encryption on Intel® Architecture Processors |
| 5 | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors |
| 6 | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors |
| 7 | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms |
| 8 | Solution Brief: Going Beyond Exceptional Computing Performance | Solution Brief: Going Beyond Exceptional Computing Performance |
| 9 | Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers | Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers |
| 10 | Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture | Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture - System Bring-up Guide |
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser | Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Schematic: Intel® 82579 Gigabit Ethernet PHY | Schematic: Intel® 82579 Gigabit Ethernet PHY |
| 2 | Datasheet: Intel® 82579 Gigabit Ethernet PHY | Datasheet: Intel® 82579 Gigabit Ethernet PHY |
| 3 | Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection | Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection |
