| 参数 | 数值 |
|---|---|
| L2 Cache | 512 KB |
| Status | Launched |
| Sockets Supported | FCBGA1466 |
| Recommended Customer Price | TRAY: $79 |
| Processor Number | E645CT |
| PCI Express* | 2.5 GT/s |
| PCI Express Configurations | x1, root complex only |
| Package Size | 37.5mm x 37.5mm |
| Memory Types | DDR2-800 |
| Max TDP | 7 W |
| Max Memory Size (dependent on memory type) | 2 GB |
| Low Halogen Options Available | See MDDS |
| Lithography | 45 nm |
| Launch Date | Q4'10 |
| # of Cores | 1 |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® Turbo Boost Technology | No |
| Intel® Hyper-Threading Technology | Yes |
| Integrated Graphics | Yes |
| Graphics Base Frequency | 320 MHz |
| Enhanced Intel SpeedStep® Technology | Yes |
| Embedded Options Available | Yes |
| ECC Memory Supported | No |
| Datasheet Url | Link |
| Clock Speed | 1 GHz |
| # of Threads | 2 |
| # of PCI Express Ports | 2 |
| # of Memory Channels | 1 |
这是将英特尔® 凌动™ 处理器与 Altera* 的现场可编程门阵列(FPGA)组合的多芯片单一封装设备。它向用户提供编程 IP、I/O 界面的灵活性以及设计优化的嵌入式系统对 FPGA 的独特要求。观看视频。
- 集成的显卡引擎: 提供硬件加速的视频编解码功能。
- 集成内存控制器: 通过降低延迟提高性能。
- 英特尔® 超线程技术: 提供应对多线程应用的出色性能。
- 英特尔® 虚拟化技术: 基于硬件的虚拟化,以实现更大的灵活性,并最大程度地提高系统利用率。
- FPGA: 配备多达 312 个用于 DSP 操作的扩接器、60,000 个逻辑元素以及 350 个用户 I/O 针
交互式结构图

应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Choosing the Right Storage Solution for Your Embedded Application | White Paper: Choosing the Right Storage Solution for Your Embedded Application |
| 2 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 3 | White Paper: JTAG 101 | White Paper: JTAG 101 |
| 4 | White Paper: Internal LVDS Dynamic Backlight Brightness Control | White Paper: Internal LVDS Dynamic Backlight Brightness Control |
| 5 | White Paper: Fastboot BIOS | White Paper: Fastboot BIOS |
| 6 | White Paper: Fanless Cooling for Embedded Applications | White Paper: Fanless Cooling for Embedded Applications |
| 7 | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles |
| 8 | White Paper: A Low-cost receiver jitter tolerance tester for FPGA Multichip Package | White Paper: A Low-cost receiver jitter tolerance tester for FPGA Multichip Package |
| 9 | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 平台简介: 面向嵌入式计算的基于英特尔® 凌动™ 处理器 E6x5C 系列的平台 | 平台简介: 面向嵌入式计算的基于英特尔® 凌动™ 处理器 E6x5C 系列的平台 |
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Thermal Design Considerations for Embedded Applications | White Paper: Thermal Design Considerations for Embedded Applications |
| 2 | White Paper: Fanless Cooling for Embedded Applications | White Paper: Fanless Cooling for Embedded Applications |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Datasheet for Arria II* Devices | Datasheet for Arria II* Devices |
| 2 | Specification Update: Intel® Atom™ Processor E6x5C Series | Specification Update: Intel® Atom™ Processor E6x5C Series |
| 3 | EP2AGXE6XXFPGA Device Handbook Volume 2: Transceivers | EP2AGXE6XXFPGA Device Handbook Volume 2: Transceivers |
| 4 | EP2AGXE6XXFPGA Device Handbook Volume 1: Device Interfaces and Integration | EP2AGXE6XXFPGA Device Handbook Volume 1: Device Interfaces and Integration |
平台概述
| 序号 | 描述 | |
|---|---|---|
| 1 | Training: Intel® Atom™ Processor E6xx Series | Training: Intel® Atom™ Processor E6xx Series |
| 2 | Training: Hands On Lab - Install OS on Intel® Atom™ Processor E6xx Series based development board | Training: Hands On Lab - Install OS on Intel® Atom™ Processor E6xx Series based development board |
| 3 | Training: Building Solutions based on the Intel® Atom™ E6xx & E6x5C Series | Training: Building Solutions based on the Intel® Atom™ E6xx & E6x5C Series |
