| 参数 | 数值 |
|---|---|
| Product name | Intel® 82945GSE Graphics and Memory Controller |
| Code Name | Formerly Calistoga |
| Datasheet | Download Datasheet |
| Dual Independent Display | Yes |
| ECC Memory | False |
| FSB Speed | 533MHz / 667MHz |
| Graphics Output | UXGA |
| Integrated Graphics | Yes |
| Launch Date | Q1'06 |
| License Required | No |
| Low Halogen Available | See MDDS |
| Max Memory | 2 GB |
| Max Memory Bandwidth | 4.2 GB/s |
| Max TDP | 6 Watts |
| Number of Memory Channels | 1 |
| Package Size | 27mm x 27mm |
基于 45 纳米技术的单核处理器（主频：1.6 GHz；TDP：2.5 瓦）经过能耗优化，可提供出色的性能功耗比。此平台提供丰富的 I/O 功能、32 位 3D 显卡和 DDR2 支持 — 是众多嵌入式市场领域的理想选择。
- 英特尔® 超线程技术： 在多任务环境中提高系统响应性能
- 能耗优化： 支持增强型英特尔 SpeedStep® 技术，低能耗睡眠状态（C1E、C2E、C4E）二级高速缓存动态调整
- 英特尔® 单指令多数据流扩展（SSE）2 和英特尔® SSE3： 在复杂计算和视频解码中加快数据处理速度
交互式结构图
应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons | White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations |
| 2 | White Paper: Fanless Cooling for Embedded Applications | White Paper: Fanless Cooling for Embedded Applications |
| 3 | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
| 4 | White Paper: Interfacing I²C Devices to Intel's SMBus Controller | White Paper: Interfacing I²C Devices to Intel's SMBus Controller |
| 5 | White Paper: JTAG 101 | White Paper: JTAG 101 |
| 6 | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles | White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles |
| 7 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 8 | White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts | White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts |
| 9 | White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines | White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines |
| 10 | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology | Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology |
| 11 | Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boo | Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boosts Performance Up to 10X |
| 12 | Application Note: Designing Embedded Systems for Testability | Application Note: Designing Embedded Systems for Testability |
| 13 | White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets | White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets |
| 14 | White Paper: Choosing the Right Storage Solution for Your Embedded Application | White Paper: Choosing the Right Storage Solution for Your Embedded Application |
| 15 | White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms | White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms |
| 16 | White Paper: Designing Systems without a Suspend Supply | White Paper: Designing Systems without a Suspend Supply |
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Fanless Cooling for Embedded Applications | White Paper: Fanless Cooling for Embedded Applications |
| 2 | White Paper: Thermal Design Considerations for Embedded Applications | White Paper: Thermal Design Considerations for Embedded Applications |
| 3 | Power Profiling for Embedded Applications | Power Profiling for Embedded Applications |
| 4 | Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series | Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series |
性能指标评测
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms | White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms |
| 2 | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I | White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture |
| 3 | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization | White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 产品简介： 适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组 | 产品简介： 适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组 |
| 2 | 英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件 | 英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件 |
| 3 | 用于嵌入式计算的英特尔® 凌动™ | 用于嵌入式计算的英特尔® 凌动™ |
| 4 | Product Brief: Intel® 82583V Gigabit Ethernet Controller | Product Brief: Intel® 82583V Gigabit Ethernet Controller |
开发主板和套件
| 序号 | 描述 | |
|---|---|---|
| 1 | 英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件 | 英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件 |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Datasheet: Intel® 82583V Gigabit Ethernet Controller | Datasheet: Intel® 82583V Gigabit Ethernet Controller |
| 2 | Product Brief: Intel® 82583V Gigabit Ethernet Controller | Product Brief: Intel® 82583V Gigabit Ethernet Controller |
| 3 | Specification Update: Intel® 82583V Gigabit Ethernet Controller | Specification Update: Intel® 82583V Gigabit Ethernet Controller |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Datasheet: Intel® I/O Controller Hub 7 (ICH7) | Datasheet: Intel® I/O Controller Hub 7 (ICH7) |
| 2 | Datasheet: Mobile Intel® Atom™ Processor N270 Single Core | Datasheet: Mobile Intel® Atom™ Processor N270 Single Core |
| 3 | Specification Update: Intel® Atom™ Processor N270 Series | Specification Update: Intel® Atom™ Processor N270 Series |
| 4 | Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family | Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family |
平台概述
| 序号 | 描述 | |
|---|---|---|
| 1 | Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platfo | Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platform |
