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HF30ACB201209-T

HF30ACB201209-T

  • 品牌:TDK
  • 包装:Blister (Plastic)Taping [180mm Reel]
  • 无铅情况/ROHS: --
  • 经营商:科通芯城自营
参数 数值
最少供货数-Nom 2000Pcs
尺寸代码 2012
表面安装分类 Yes
直流电阻-Max 0.1Ohm
阻抗容差-Min -25%
阻抗测定频率-Nom 100 MHz
电路数-Nom 1
适用焊接方法 Reflow,Iron Soldering
保存温度范围-Max 85Cel
额定电流-Max 0.6A
使用温度范围-Max 85Cel
最少包装数-Nom 2000Pcs
形状 Chip
主体横宽(L)-Nom 2 mm
包装形式 Blister (Plastic)Taping [180mm Reel]
重量-Nom 0.01g
主体高度(T)-Nom 0.9 mm
阻抗容差-Max 25%
主体纵长(W)-Nom 1.25 mm
使用温度范围-Min -25Cel
保存温度范围-Min -40Cel
工艺 MULTI-LAYER
阻抗-Nom 7Ohm

概要
This extensive series completely covers impedance values ranging from 7 to 125ohm[100MHz] and can be applied to a wide range of circuits.
用途
General EMI suppression.(RADIATION,IMMUNITY) For PC,CD-ROM,DVD and DVD-ROM,TV,VIDEO CAMERA,PDP,LCD-PANEL,MOBIL COMMUNICATIONS etc.
特点
The 2012, 3216, 3225 and 4532 types all use HF70, 50 and 30 materials. The most suitable component can be selected for the circuit pattern and the suppression band.These components are applicable for both flow and reflow solderings, and have outstanding physical characteristics such as excellent terminal strength, body strength, resistance to soldering heat, solderability and mounting reliability.It is a product conforming to RoHS directive.

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