Broadcom develops a broad range of digital subscriber line (DSL), Powerline Communications Solutions, Ethernet Passive Optical Networking (EPON) and Gigabit Passive Optical Network (GPON) silicon and software solutions. Broadcom's DSL solutions are for both central office (CO) and customer premises equipment (CPE) applications. These advanced DSL semiconductor solutions, which include xDSL modem chips, xDSL CPE chips, xDSL CO chips and other DSL modem solutions, enable local exchange carriers to deliver to end users bundled broadband services such as high-speed Internet access, digital telephony, video teleconferencing, digital broadcast video and IP data business services, over existing copper telephone lines. Broadcom's scalable family of GPON products, spanning from gigabit bridges to fully integrated access device (IAD) capabilities, leverage field proven processor, switch and physical layer (PHY) intellectual property cores, in conjunction with the industry's most widely deployed Linux? and voice over IP (VoIP) software suite, enabling Fiber-to-the-Home (FTTH) and Fiber-to-the-Node (FTTN) solutions.
Silicon and software EPON solutions are focused on access network applications for the FTTx market, and support 1 Gbps and 2 Gbps downstream speeds. These Turbo-EPON? products enable service providers and carriers to deliver residential broadband, voice, and IPTV services, enterprise services such as voice, TDM, and Internet connectivity, as well as 2.5G, 3G, and 4G cellular backhaul transport services.
Powerline communications solutions create an "Invisible Home Network" which can provide entertainment quality digital content everywhere in the home. This network requires no new wires, no configuration software, and no knowledge of networking technology to install or manage. xDSL CO Chips, xDSL CPE Chips, and GPON gateway processor solutions use Broadcom's xDSL central office (CO), xDSL Modem and GPON solutions to achieve the highest level of integration and performance when designing next-generat
