| 参数 | 数值 |
|---|---|
| Intel® vPro Technology | No |
| USB Revision | 2.0 |
| Supplemental SKU | No |
| Status | Launched |
| Recommended Customer Price | T&R : $37 |
| PCI Support | Yes |
| PCI Express Revision | 2.0 |
| PCI Express Configurations | x1, x2, x4 |
| Max TDP | 6.1 W |
| Low Halogen Options Available | See MDDS |
| Lithography | 65 nm |
| Launch Date | Q1'11 |
| # of PCI Express Ports | 8 |
| Intel® Virtualization Technology for Directed I/O (VT-d) | No |
| Intel® Trusted Execution Technology | No |
| Intel® Rapid Storage Technology | No |
| Intel® Clear Video Technology | Yes |
| Intel® Anti-Theft Technology | No |
| Integrated LAN | MAC |
| Integrated Graphics | Yes |
| Embedded Options Available | Yes |
| Dual Display Capable | Yes |
| # of USB Ports | 12 |
| # of SATA Ports | 6 |
这些基于英特尔® 微体系（代号：Sandy Bridge）的处理器支持四核和双核配置，可增强媒体和图形功能、降低平台的整体能耗和空闲能耗。观看视频。
- 英特尔® 高级矢量扩展： 为信号和图形处理应用加快计算处理速度。
- 英特尔® 高速视频同步技术： 提高媒体性能、为其它任务提供 CPU 可用性。
- 英特尔® 睿频加速技术 2.0： 以更高的频率来提高应用程序运行速度。
- 英特尔® 博锐™ 技术： 为关键的安全性和管理功能提供前所未有的硬件支持。
交互式结构图
散热和机械
| 序号 | 描述 | |
|---|---|---|
| 1 | Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Ser | Thermal Mechanical Specifications and Design Guidelines (TMSDG): Intel® 6 Series and Intel® C200 Series Chipset |
| 2 | Thermal Mechanical Specifications and Design Guidelines (TMSDG): 2nd Generation Intel® Core™ Process | Thermal Mechanical Specifications and Design Guidelines (TMSDG): 2nd Generation Intel® Core™ Processor (Desktop) Family and LGA1155 Socket |
产品简介
| 序号 | 描述 | |
|---|---|---|
| 1 | 产品简介： 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组 | 产品简介： 英特尔®赛扬®处理器G540 配合 英特尔® C206、英特尔® Q67高速芯片组、英特尔® B65高速芯片组和 英特尔® H61高速芯片组 |
| 2 | 产品简介： 面向嵌入式计算的基于第二代智能英特尔® 酷睿™ i7-2600、英特尔® 酷睿™ i5-2400 和英特尔® 酷睿™ i3-2120 处理器的平台 | 产品简介： 面向嵌入式计算的基于第二代智能英特尔® 酷睿™ i7-2600、英特尔® 酷睿™ i5-2400 和英特尔® 酷睿™ i3-2120 处理器的平台 |
| 3 | " 产品简介： 英特尔® 奔腾® 处理器 G850 与英特尔® C206，英特尔® Q67 Express，英特尔® B65 Express 和英特尔® H61 高速芯片组 " | " 产品简介： 英特尔® 奔腾® 处理器 G850 与英特尔® C206，英特尔® Q67 Express，英特尔® B65 Express 和英特尔® H61 高速芯片组 " |
应用注释
| 序号 | 描述 | |
|---|---|---|
| 1 | White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performa | White Paper: Using Intel® AES New Instructions and PCLMULQDQ to Significantly Improve IPSec Performance on Linux* |
| 2 | White Paper: Platform-Level error Handling Strategies for Intel® Systems | White Paper: Platform-Level error Handling Strategies for Intel® Systems |
| 3 | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors | White Paper: Optimized Galois-Counter-Mode implementation on Intel® Architecture processors |
| 4 | White Paper: Intel® Virtualization Technology for Directed I/O | White Paper: Intel® Virtualization Technology for Directed I/O |
| 5 | White Paper: High Performance Storage Encryption on Intel® Architecture Processors | White Paper: High Performance Storage Encryption on Intel® Architecture Processors |
| 6 | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors | White Paper: High Performance DEFLATE Decompression on Intel® Architecture Processors |
| 7 | White Paper: Generating More Vending Machine Revenue with Digital Signage and Video Analytics | White Paper: Generating More Vending Machine Revenue with Digital Signage and Video Analytics |
| 8 | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors | White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors |
| 9 | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms | White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms |
| 10 | White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family | White Paper: Cryptographic Performance on the 2nd Generation Intel® Core™ Processor Family |
| 11 | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs | White Paper: Considerations for Designing an Embedded IA System with DDR3 SO-DIMMs |
| 12 | Solution Brief: Going Beyond Exceptional Computing Performance | Solution Brief: Going Beyond Exceptional Computing Performance |
| 13 | Case Study: Intel® Technology Helps Medical Specialists More Quickly Reach-and Treat-Patients in Rem | Case Study: Intel® Technology Helps Medical Specialists More Quickly Reach-and Treat-Patients in Remote Areas |
| 14 | Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture | Application Note: Embedded Scalable Platforms based on 2nd Generation Intel® Core™ Microarchitecture - System Bring-up Guide |
数据表和规格更新
| 序号 | 描述 | |
|---|---|---|
| 1 | Specification Update: Intel® 6 Series and Intel® C200 Series Chipset | Specification Update: Intel® 6 Series and Intel® C200 Series Chipset |
| 2 | Specification Update: 2nd Generation Intel® Core™ Processor (Desktop) Family | Specification Update: 2nd Generation Intel® Core™ Processor (Desktop) Family |
| 3 | Datasheet: Intel® 6 Series and Intel® C200 Series Chipset | Datasheet: Intel® 6 Series and Intel® C200 Series Chipset |
| 4 | Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 2 of 2 | Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 2 of 2 |
| 5 | Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 1 of 2 | Datasheet: 2nd Generation Intel® Core™ Processor (Desktop) Family, Volume 1 of 2 |
以太网控制器
| 序号 | 描述 | |
|---|---|---|
| 1 | Schematic: Intel® 82579 Gigabit Ethernet PHY | Schematic: Intel® 82579 Gigabit Ethernet PHY |
| 2 | Datasheet: Intel® 82579 Gigabit Ethernet PHY | Datasheet: Intel® 82579 Gigabit Ethernet PHY |
| 3 | Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection | Application Note: Intel® 82579LM Gigabit Ethernet PHY iSVR Inductor Selection |
