The Cadence® Palladium® series delivers high system throughput, verification automation, and advanced debug to perform plan- and metric-driven system-level hardware/software co-verification. Capable of handling chip designs of up to 256 million gates, it also enables software to be developed and verified on a real hardware implementation using live data.
The Palladium series leverages advanced RTL and ESL verification automation features, such as assertion-based acceleration and transaction-based acceleration. It also uses “real-world” stimuli provided by external equipment. The Palladium series emulates HW/SW designs at up to MHz speeds— months before silicon tapeout—reducing the risk in committing to final silicon.
The Palladium series is available in I, II, and III configurations.
Features/Benefits
- Reduces time to results with high throughput (up to 1,000,000X faster than RTL simulation)
- Eases adoption with fast bring-up time from simulation to acceleration and emulation
- Speeds time to closure via advanced interactive runtime debug with dynamic probes and events, FullVision and Infinite Trace
- Teams with “real-world” external test equipment and systems via plug-n-play SpeedBridge® adapters for standard bus protocols
- Leverages Incisive Enterprise Manager to manage verification system-wide
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Supports industry standard languages:
- Testbench development: Verilog®, SystemVerilog, C, C++, SystemC® Verification Library, and e
- Assertion-based acceleration: OVL, PSL, SVA, and the Incisive Assertion Library
- Transaction-based acceleration: SystemC, C, C++, and e models
- Assertion-based verification IP: AHB, AXI, Gigabit Ethernet (GMII), USB 2.0
| 序号 | 描述 | |
|---|---|---|
| 1 | De-Mystifying SCE-MI Transactors for Simulation Acceleration White Paper | De-Mystifying SCE-MI Transactors for Simulation Acceleration White Paper |
| 2 | Power-Aware Verification Spans IC Design Cycle White Paper | Power-Aware Verification Spans IC Design Cycle White Paper |
| 3 | Integrating Virtual Prototypes with IC Verification White Paper | Integrating Virtual Prototypes with IC Verification White Paper |
| 4 | Building Energy-Efficient ICs from the Ground Up White Paper | Building Energy-Efficient ICs from the Ground Up White Paper |
| 序号 | 描述 | |
|---|---|---|
| 1 | Speeding up HW/SW Co-Development using HW Emulation | Speeding up HW/SW Co-Development using HW Emulation |
| 2 | Specman Technology and Palladium System Speed up Time to Market While Reducing Risk of Respins | Specman Technology and Palladium System Speed up Time to Market While Reducing Risk of Respins |
| 3 | Next-Generation SoC Architectures Will Include Intrinsic Ability to See Inside Silicon | Next-Generation SoC Architectures Will Include Intrinsic Ability to See Inside Silicon |
| 4 | Network Processor HW/SW Co-Verification: A Case Study | Network Processor HW/SW Co-Verification: A Case Study |
| 5 | HW/SW Co-Simulation | HW/SW Co-Simulation |
| 序号 | 描述 | |
|---|---|---|
| 1 | QLogic Depends on Verification for First-time Silicon Success | QLogic Depends on Verification for First-time Silicon Success |
| 序号 | 描述 | |
|---|---|---|
| 1 | Cadence SpeedBridge Adapter for Multi-ethernet Datasheet | Cadence SpeedBridge Adapter for Multi-ethernet Datasheet |
| 2 | Cadence SpeedBridge adapter for ARM Logic Tiles Datasheet | Cadence SpeedBridge adapter for ARM Logic Tiles Datasheet |
| 3 | Cadence Palladium Series with Incisive XE Software Datasheet | Cadence Palladium Series with Incisive XE Software Datasheet |
| 序号 | 描述 | |
|---|---|---|
| 1 | Cadence and Unisys Success Story | Cadence and Unisys Success Story |
| 2 | Cadence and STMicroelectronics Success Story | Cadence and STMicroelectronics Success Story |
| 3 | Cadence and Sigma Success Story | Cadence and Sigma Success Story |
| 4 | Cadence and Agere Success Story | Cadence and Agere Success Story |
