品牌介绍
成立时间1988年 总部位于美国加州圣何塞 现拥有员工约4800名 股票代码CDNS(纳斯达克)，市值31.7亿美元 全球知名半导体与电子系统公司均将Cadence软件作为其设计标准 自1991年以来，Cadence已连续在国际EDA市场中销售业绩稳居第一
主打产品系列
Allegro PCB
OrCAD PCB
应用领域
服务于全球2万亿电子市场，包括超过3000亿的半导体市场
| 型号 | 产品描述 | RoHS | 操作 |
|---|---|---|---|
| Allegro Package Designer | Provides a complete constraint- and rules-driven substrate layout and interconnect environment. Opti... | 立即询价 | |
| Allegro Package SI | Delivers a virtual prototyping design and simulation environment for IC packages using accurate 3D s... | 立即询价 | |
| Cadence 3D Design Viewer | Provides 3D visualization and wirebond design rule checking (DRC) for IC packages. Enables collabora... | 立即询价 | |
| Cadence SiP Co-Design | Flexible chip-package co-design methodologies with supporting utilities allow for customizable co-de... | 立即询价 | |
| Cadence SiP Digital Architect | Enables experimentation at the initial design stages for maximum functional density and performance.... | 立即询价 | |
| Cadence SiP Digital SI | Integrates digital SI analysis and interconnect extraction using SPICE-based simulation and embedded... | 立即询价 | |
| Cadence SiP Layout | Provides a complete constraint- and rules-driven substrate layout and interconnect environment. Opti... | 立即询价 | |
| Cadence Virtuoso SiP Architect | Delivers a single schematic and simulation solution for RF/analog ICs and complex IC package substra... | 立即询价 |
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